Package Lineup
From this web page, you can get package product information, such as package shapes and dimensions, cautions that need to be exercised at the time of assembly, and chemical substances in products.
* Some of these packages have WCSP product. For more information, please contact your Epson sales representative.
For the environmental profile common to all the IC packages listed on this web page, please refer to the following file:
Common Ecology Profile (43KB)
Information on Substances of Very High Concern in our products
About the details of our IC products, please click here. (84KB)
About the RoHS Compliance Information of our IC package products, please click the following link.
Eu-RoHS Compliance (package) (69KB)
China-RoHS Compliance (181KB)
About the RoHS Compliance Information of our IC Chip products, please click the following link.
Eu-RoHS Compliance (die) (39KB)
China-RoHS Compliance(die) (80KB)
PFBGA (Plastic Fine-pitch Ball Grid Array)
VFBGA (Very Thin Fine-pitch Ball Grid Array)
PBGA (Plastic Ball Grid Array)
LQFP (Low Profile Quad Flat Package)
TQFP (Thin Quad Flat Package)
QFN (Quad Flat Non-leaded Package)
PLP (Plating Lead Package)
*1 Some products have different storage conditions. For more information, please contact your Epson sales representative.
*2 Au wire