Quality Information
Quality Management System certification
Seiko Epson quickly began working to acquire company-wide ISO certification. Electronic Devices; Semiconductor Operations has acquired ISO9001 and IATF16949(ISO/TS16949) certification with its IC, module and their application products.
ISO9001
| Type of Certification | ISO9001: 2015 |
|---|---|
| Awarded to | Tohoku Epson Corporation, Seiko Epson Corporation(Fujimi Plant, Suwa Minami Plant, Hirooka,Hino Office, Material Analysis & CAE Center) |
| Certified by | Bureau Veritas Certification |
| Certificate No. | JP026853 |
| Initial Date of Certification | October 10, 1993 |
| Date of expiration | December 10, 2028 |
| Certificate | ISO9001 Certificate  (1,497KB) |
IATF16949
| Type of Certification | IATF16949:2016 |
|---|---|
| Awarded to | Tohoku Epson Corporation, Seiko Epson Corporation (Fujimi Plant, Hirooka Office, Hino Office), Epson Europe Electronics GmbH, Epson America Inc.(Huntington Beach warehouse, San Jose Office), Epson Canada Ltd. (Vancouver Design Center), Epson (China) Co., Ltd. (Shenzhen Branch), Epson Hong Kong Ltd. |
| Certified by | Bureau Veritas Certification |
| Certificate No. | 0492977 |
| Initial Date of Certification | December 9, 2017 |
| Date of expiration | December 21, 2026 |
| Certificate | IATF16949 Certificate (1,573KB) |
Note; Please scrap the pdf file or print of certificates properly when the date of expiration has passed.
ISO9001:
ISO9001 is an international standard for a product quality system that prescribes demands to the manufactures on a standpoint of customers.
IATF16949:
IATF16949 is an international standard of Quality management system for Automotive industry.
Environment Management System [ISO14001 certification status]
Third party certification status
Epson semiconductor business has EMS certification by the third party concerning the following content.
EMS Environment Management System certification status
| Type of certification | ISO 14001: 2015, JIS Q 14001: 2015 |
|---|---|
| Awarded to | Fujimi plant/Suwa-minami plant/Tohoku Epson Corp. |
| Certified by | Bureau Veritas Certification |
| Date of certification | April 3, 1999 |
| Date of expiration | May 19, 2029 |
| ISO14001 certification | ISO14001 certification (Fujimi plant/Tohoku Epson Corp.) (1,835KB) |
- Print the certifications in PDF above, if necessary. No alterations are permitted in any circumstances.
- Take care not to cause misunderstanding about the certified scope and site.
- Please scrap the pdf file or print of certificates properly when the date of expiration has passed.
ISO14000 series
International Standard for Environment System
In 1996 International Organization for Standardization set ISO14000 as a global standard against global warming, ozone depletion and forest resources depletion.
Products Credibility Activities
We would set test item and sample depend on not only intended use or usage environment for devices also novelty and priority of products, then we would test reliability evaluation. We would curry out a environment test and mechanical test according to product type. The product specificity is considered in order to adapt various product type and the test condition is set accordingly.
Qualification Test items (example)
| TEST ITEM | TEST CONDITON | TEST DURATION | STANDARD |
|---|---|---|---|
| Temperature cycling (TC) |
-65°C to 150°C | 200CYC. |
|
| High Temperature operating life (HTOL) |
125°C / Vdd-max | 1000h |
|
| High Temperature humidity bias (HTB) |
85°C / 85%RH/ Vdd-max | 1000h |
|
| High Temperature storage (HTS) |
150°C | 1000h |
|
| Low temperature storage | -65°C | 1000h |
|
| UNBIASED HAST | 130℃ / 85%RH, 2.3E5Pa | 200h |
|
| Resistance to soldering heat | Moisture soaking → reflow | 3 Time |
|
Mechanical Test items (example)
| TEST ITEM | TEST CONDITON | TEST DURATION | STANDARD |
|---|---|---|---|
| Thermal strength (Pull test) |
2.2N, 30 seconds | 1 Time |
|
| Thermal strength (Bending test) |
30 degree | 2 Time |
|
| Solderability 1 (Pb free) | Steam Aging → solder dipping | 4h → 245°C, 5seconds |
|
| Solderability 2 (Pb free) | baking → solder dipping | 150°C, 16h → 245°C, 5seconds |
|
